
NXP Semiconductors
PESD5V0V1BA/BB/BL
Very low capacitance bidirectional ESD protection diodes
Footprint information for reflow soldering of plastic surface-mounted, 2 leads package
2.15
1.4
1.2
0.4
(2×)
0.5
(2×)
0.5 0.6
(2×) (2×)
SOD523
solder land
solder paste deposit
solder land plus solder paste
solder resist
occupied area
Dimensions in mm
sod523_fr
Fig 15. Reflow soldering footprint PESD5V0V1BB (SOD523/SC-79)
1.3
0.7
R0.05 (8 × )
solder lands
0.9
0.3
(2 × )
0.4
(2 × )
0.5
(2 × )
0.6 0.7 0.8
(2 × ) (2 × ) (2 × )
solder resist
solder paste
occupied area
Dimensions in mm
sod882_fr
Fig 16. Reflow soldering footprint PESD5V0V1BL (SOD882)
PESD5V0V1BA_BB_BL
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 9 November 2012
? NXP B.V. 2012. All rights reserved.
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